Lincoln, Abraham (1809-1865)

Description:

Lincoln, Abraham (1809-1865), Autograph letter signed, two pages, Springfield, July 27, 1860, to the Honorable Julius Rockwell, concerning the signing of a blank bond to his son Robert, attending Harvard, (very good); sold together with an autograph letter from Robert T. Lincoln, thanking him for signing the bond.

Text in full: "My dear Sir: My son, who has entered Harvard University, sends you the enclosed blank bond, which, with the head note, explains itself. I think of you more readily than any other citizen of Massachusetts, as one who would probably be willing to oblige me, by signing it. I have, however, requested our friend Judge D. Davis, to write you on the subject; and I do not ask you to sign the bond unless his letter shall be entirely satisfactory. If it be satisfactory, please fill the blanks properly, sign the bond, and enclose it to "Robert T. Lincoln", Exeter, New Hampshire, for which I shall be greatly obliged. I suppose I know little, if any more, about political prospects, than you, but so far as I can see, they look very well. Yours very truly, A. Lincoln."
Estimate $15,000-20,000

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